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Base materials role for high-performance PCBs

Aug 13 2020

Press release

Base materials role for high-performance PCBs

Date: 13 August, 2020 10:00 PM

Base materials and laminates, in particular, are increasingly important to high-performance PCBs; low losses as well as low dielectric constant (or consistent dielectric constant) are both critical specs for laminates.
Higher heat resistance is needed for lead-free assembly processes: laminates that need to resist to high temperature must have a higher Decomposition Temperature (called Td).
 
Additional features important for the new laminates are:
  • uniform glass distribution to get a better quality in laser drilling
  • thinner glass fabrics to get better electrical properties
  • thin dielectrics for distributed capacitance between power and ground 
Moreover, a wide range of laminates that allow to realize embedded components like resistors and/or capacitors are coming from laminates manufacturers.
 
New laminates “designed” for high-performance PCBs have to be reviewed under thermal-mechanical and electrical aspects.
Here following a list of the typical characteristics to take under consideration during the base material choice.
 
CTE
  • Thermal expansion in x, y and z-axis with special impact on the z-axis for the reliability of the vias (e.g. barrel cracking) and withstand multiple pressing processes. 
Loss tangent (Df) and permittivity (Dk)
  • Parameters for signal integrity and impedance requirements. 
Glass type and resin content
  • Uniform glass distribution helps to get a better quality in laser drilling.
  • Thinner glass fabrics help to get better electrical properties.
  • Thin dielectrics make it possible to get a better distribution of capacitance between power and ground.
 
Glass transition temperature Tg
  • The temperature at which the material stops acting as a rigid material.
Decomposition temperature Td
  • Higher heat resistance is needed for lead-free assembly processes: laminates that need to resist to high temperature must have a higher Decomposition Temperature (called Td). This is the temperature that a laminate can withstand when it has lost 5% of its weight by thermal gravimetric analysis (TGA). 
Humidity Impact on final product
  • mportant aspects may be the CAF Resistance and moisture absorption. 
Environmental Impact
  • Need of “Low Halogen” laminates for the green electronic
All validated materials used in Cistelaier are listed here following, in cursive the specific ones for high-performance PCBs.
 
Standard FR4, high Tg Laminates also Halogen Free and specific for High Speed Digital:
  • FR4 standard & Leadfree: Iteq IT140 & IT588; Isola Duraver ML104i - Tg 140 °C; Black FR4
  • Mid Tg epoxy for Lead-free process: Iteq IT158 -Tg 160 °C; Isola IS400 -Tg 150 °C
  • Mid Tg– Halogen Free: Iteq IT40G -Tg 140 °C, IT150G
  • High Tg 180°C epoxy (without filler): Iteq IT180 (also No/Low flow Prepreg); Isola IS420& IS410; ARLON 45N
  • High Tg 180°C epoxy (with filler): Iteq IT180A & IT180i; Isola PCL370HR; Nelco N4000-29; Hitachi 700GR; EMC 827 i
  • High Tg 170°C epoxy – Halogen Free: Iteq IT170GRA1 & IT170G & IT180GN
  • High speed application: Nelco N4000-13(Si) & N4800-20(Si); Isola Fr408HR, IS600(series), Astra and I-Tera; Iteq IT200DK and IT150DA(SE), IT-968 (SE), IT-988G, IT-988G SE; Panasonic Megtron6 and Megtron7
  • Capacitance layer: OAK-Mitsui Faradflex
 
High-performances materials for avionic/military application:
  • Polyimide Resin System: Arlon 33N, 35N, 84N, 85N, 85HP; Ventec VT901(also No/Low flow); Hitachi MCL-I-671; Isola 95P/96P; NELTEC N 7000VO
  • Epoxy Resin System: Arlon® Kevlar 4NK (Tg 170 °C and 4.7 ppm/°C)
  • Epoxy and Polyimide Thermount® & Para Aramid fiber: ARLON 55NT/85NT
  • Copper/Invar/Copper: tipically 150 μm thick - 17/120/17 μm)
  • Thick copper: up to 500 microns and over, for BusBar application and copper inlay&coin technology
Substrates for flexible circuits:
  • Flexible Laminates-Polyimide film based: DuPont PYRALUX LF; PYRALUX FR
  • Flexible Laminates- Polyimide film based Adhesiveless: PYRALUX AP, PYRALUX AP-Plus & PYRALUX TK
  • Flexible Laminates-Polyimide based Adhesiveless: UBE Upilex; Iteq IF-2LD; Panasonic Felios
  • Emi shielding layer: Tatsuta SF-PC6000 and TATSUTA SF-PC 3300
High Frequency materials Teflon® based and non-Teflon based:
  • Rogers® / Arlon (also Copper/Brass supported): RT/Duroid Family; RO3000 Family; TMM Family; DiClad Family; Isoclad Family; Cuclad Family; AD Family; AR Family; TC Family
  • Rogers® / Arlon®: RO4350 & RO4003 (Back up material for discontinued 25N & 25FR but partially applicable)
  • Rogers®: ULTRALAM® 3850HT - Liquid Crystalline Polymer (LCP)
  • Iteq “new generation” material for RF and Microvawe applications IT-88GMW, IT-8300GA, IT-8338G, IT-8338A, IT-8350G, IT-8350A, IT-8615G with Dk from 3,00 up to 6,15(,05)
  • Taconic®: RF25A2, RF35, RF35A2, RF45, RF60, TSM-DS3, Cer10, FastRise, TACLAM Plus and all teflon family (TLX, TLY, TLE)
  • Nelco: Mercurywave series, Meteorwave (1000 & 4000 Series) and all teflon family
  • Foam: Rohacel HF51.
www.cistelaier.com
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